The beko Allcon 10+ is a one-component, solvent-free, polyurethane-based structural adhesive. It bonds wood, wood-based materials, metals, stone, concrete, ceramics, many plastics, and insulation materials without a primer. According to the manufacturer, it is tested according to DIN EN 204 D4 and can bear loads after approximately 7 to 10 minutes. The 310 ml cartridge fits standard cartridge guns.
The adhesive is aimed at carpenters, interior fitters, drywallers, plumbers and electricians as well as DIY enthusiasts who want to permanently bond different materials; the POINT Ultra High Tack cartridge gun is suitable for dispensing tough adhesives .
Typical uses and points to check before processing:
One adhesive for many materials replaces several specialty products and saves storage space in the workshop and vehicle; for quick spot bonding of small parts, there is also the POINT 501 FIX EXPRESS adhesive with activator .
The material, substrate moisture and joint gap are crucial, because the adhesive hardens with moisture and bridges gaps of up to about 1 cm.
The adhesive reacts with air or substrate moisture and foams up slightly; water mist accelerates the curing process, with a curing rate of approximately 3 mm per 24 hours.
Join the parts within approximately 3 minutes and press or fix them until the adhesive sets; test gluing is recommended.
Apply the adhesive at temperatures between +5 and +40 °C; it can be painted over and varnished over, but compatibility with the paint should be checked beforehand.
The most important information for selection and processing at a glance; the values are taken from the beko product information sheet Allcon 10+ (print date 08/2026).
| Manufacturer | beko GmbH |
| Article numbers and EAN | Manufacturer 265 100 310; Shop 9653; EAN 4036421265014 |
| base | Polyurethane, moisture-curing; one-component, solvent-free |
| Content and color | 310 ml cartridge; grey |
| Skin formation time | Approximately 3 minutes at +23 °C and 50% relative humidity |
| Curing | Approximately 3 mm per 24 hours; surface bonding approximately 70% after 7–10 minutes, 100% after 30–45 minutes |
| Gap bridging | Approx. 1.0 cm |
| Temperatures | Processing temperature +5 to +40 °C; resistance −40 to +80 °C, briefly +120 °C |
| Exams | DIN EN 204 D4; WATT 91 (+80°C); GEV-EMICODE EC1 Plus |
| Suitable substrates | Wood, chipboard and fiberboard, MDF, coated boards, metals, aluminum, natural and artificial stone, concrete, marble, ceramics, plastics, plasterboard, EPS, rigid foam, acrylic, insulation materials |
| Not suitable for | Glass, bituminous and wax-containing substrates, PE, PP, PA, EPDM, PTFE; underwater bonding |
| storage | Store in a cool, dry place at room temperature; unopened approx. 1.5 years, opened approx. 10 months |